JPR Solderless Prototyping Breadboard

JPR Solderless Prototyping  Breadboard
  • 400 tie points
  • 2 Power lanes - Tie-point 100
  • 1 double-strip - Tie point 300
  • Size  8.2 x 5.5 x 0.85cm
  • Plastic housing, metal contact clips
  • Accepts wire with diameter 20-29 AWG
  • Voltage / Current: 300V / 3-5A




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